| 发明名称 |
EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD COMPRISING INSULATING LAYER USING SAME |
| 摘要 |
An epoxy resin composition according to an embodiment of the present invention comprises an epoxy resin, a curing agent, and an inorganic filler, wherein the inorganic filler contains a boron nitride having a surface on which a metal oxide film is formed. |
| 申请公布号 |
WO2015167149(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
WO2015KR03831 |
申请日期 |
2015.04.16 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
GU, JINA;GIL, GUN YOUNG;PARK, JAE MAN;YUN, SUNG JIN |
| 分类号 |
C08K3/38;C08K3/22;C08K9/02;C08L63/00 |
主分类号 |
C08K3/38 |
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