| 摘要 |
The present invention relates to a probe pin for testing a semiconductor device. The probe pin is made of conductive materials. The probe pin comprises: a needle unit through which a current passes, wherein one end of the needle unit comes in contact with a terminal of the semiconductor device; a sleeve unit for insulating a part of an outer circumference of the needle unit; a body unit made of conductive materials, wherein one end of the body unit is coupled to the other end of the needle unit; and a barrel unit for vertically moving the body unit in a longitudinal direction, wherein the other end of the body unit is inserted into the barrel unit and the barrel unit surrounds a part of the outer circumference of the body unit. The probe pin precisely comes in contact with a dense contact terminal of the semiconductor device to be applicable to a micro-semiconductor terminal. |
