FOLDED COURRUGATED SUBSTRATE INTEGRATED WAVEGUIDE

摘要

A folded corrugated substrate integrated waveguide is disclosed. The folded corrugated substrate integrated waveguide, according to one embodiment of the present invention, comprises: a first conductor plate having upper surface stubs respectively formed on both sides thereof in the lengthwise direction; a first dielectric substrate of which the upper surface is attached to the lower surface of the first conductor plate; a second conductor plate of which the upper surface is attached to the lower surface of the first dielectric substrate; a second dielectric substrate of which the upper surface is attached to the lower surface of the second conductor plate; and two stub conductor arrays spaced at a certain distance so as to be arranged in parallel to each other and attached to the lower surface of the second dielectric substrate, wherein each of the stub conductors in the two stub conductor arrays is electrically connected to a position corresponding to the upper surface stub of the first conductor plate through a via-hole which vertically penetrates the first dielectric substrate, the second conductor plate, and the second dielectric substrate.

主权项

1. A folded corrugated substrate integrated waveguide comprising:
a first conductor plate comprising top stubs formed lengthwise on both sides; a first dielectric substrate whose top surface is attached to a bottom surface of the first conductor substrate; a second conductor plate whose top surface is attached to a bottom surface of the first dielectric substrate; a second dielectric substrate whose top surface is attached to a bottom surface of the second conductor plate; and stub conductors disposed in two rows in parallel with a certain interval and attached to a bottom surface of the second dielectric substrate, wherein the respective stub conductors of the two rows are electrically connected to the top stubs of the first conductor plate, whose locations correspond thereto, through via holes which vertically penetrate the first dielectric substrate, the second conductor plate, and the second dielectric substrate.