| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable epoxy resin composition capable of forming a cured article excellent in transparency, for example when used as an encapsulation material of an optical semiconductor device, excellent in light resistance and crack resistance in a heat cycle test by optimizing temperature and time in a curing condition.SOLUTION: There is provided a manufacturing method of a cured article including, under a curing condition of temperature of 95°C or more and 135°C or less for 4.5 hours or longer, curing a curable epoxy resin composition which contains an aliphatic epoxy compound (A) as a curable component, a curing agent (B), and a curing accelerator (C) with the content of the aliphatic epoxy compound (A) of 60 mass% to the total amount of the curable component, and further contains a compound having a hydroxyl group. |
