| 摘要 |
PROBLEM TO BE SOLVED: To suppress a blister in a resist or a defect by peeling, which occurs in developing a resist with an alkaline developer.SOLUTION: A resist composition is provided, comprising (A) an alkali-developable resin composition, (B) a photopolymerization initiator, and (C) an organic solvent, in which an organic solvent comprising propylene glycol monomethylether acetate (PGMEA) and a dibasic acid ester as essential components is used for the (C) organic solvent. More preferably, an ester selected from dimethyl succinate, diethyl succinate, dimethyl adipate, diethyl adipate, dimethyl glutarate, and diethyl glutarate is used as the above dibasic acid ester. |
