IMAGING CIRCUITRY WITH ROBUST SCRIBE LINE STRUCTURES

摘要

An image sensor wafer may be stacked on top of a digital signal processor (DSP) wafer. The image sensor wafer may include multiple image sensor dies, whereas the DSP wafer may include multiple DSP dies. The stacked wafers may be cut along scribe line regions to dice the wafers into individual components. Each image sensor die may include through-oxide vias (TOVs) that extend at least partially into a corresponding DSP die. Scribe line support structures may be formed surrounding the scribe line regions. The scribe line support structures and the TOVs may be formed during the same processing step. The TOVs can also be formed through deep trench isolation structures.

主权项

1. A method of manufacturing imaging circuitry, comprising:
stacking an image sensor wafer on a digital signal processor wafer; forming a through-oxide via in the image sensor wafer, wherein the through-oxide via extends at least partly into the digital signal processor wafer; and forming scribe line support structures at the same time as the through-oxide via.