STRUCTURE AND METHOD FOR PREPARING A HOUSING TO ACCEPT A COMPONENT FOR AN EMBEDDED COMPONENT PRINTED CIRCUIT BOARD

摘要

A method and electrical interconnect structure internal to a printed circuit board for the purposes of creating a reliable, high performing connection method between embedded component terminals, signal traces and or power/ground planes which may occupy the same vertical space as the embedded components, such as a capacitor or resistor. Further easing the assembly and reliability through the manufacturing process of said embedded component structures. In one structure castellated drilled, plated vias connect the trace or plane within the printed circuit board to the electrical terminals of the embedded component using a permanent and highly conductive attach material. In another structure, the trace or plane connect by selective side-wall plating, which surrounds the electrical terminal of the component. This structure also uses a permanent and highly conductive attach material to electrically connect the component terminal to the plated side-wall and in a final embodiment the terminals are connected through a conductive attach material through a via in the z axis to a conductive pad.

主权项

1. A method for producing an electrical interconnect structure between a component terminal and a printed circuit board structure or subassembly, the steps comprising:
Forming a printed circuit board or subassembly by: Laminating adhesive or prepreg to a first conductive foil only partially curing; laser or mechanically drilling vias in said printed circuit board or said subassembly through the adhesive to expose the first copper foil; filling the vias with conductive adhesive material; tack bonding or tack laminating again not fully curing an unclad dielectric material with cut outs of an approximate shape to accommodate one or more components that are to be embedded within said printed circuit board or said subassembly; and placing said one or more embedded components within said dielectric material cutouts thereby placing said end points of the one or more embedded component terminals in close proximity to said vias filled with said conductive adhesive material to provide electrical conductivity following a curing of said formed printed circuit board or said formed subassembly; preparing a second foil, laminating adhesive or prepreg partially curing adhesive to said second conductive foil. Laser or mechanically drilling vias through said adhesive to expose the second copper foil and filling the vias with conductive adhesive substance; aligning said second foil with top portion of said unclad dielectric materials so that said vias of said second foil are aligned with end points or terminals of opposite sides of said one or more embedded components; laminating both first and second foils while finally curing the conductive adhesive substance.