Stacked Dies With Wire Bonds and Method

摘要

Semiconductor dies are bonded to each other and electrically connected to each other. An encapsulant is utilized to protect the semiconductor dies and external connections are formed to connect the semiconductor dies within the encapsulant. In an embodiment the external connections may comprise conductive pillars, conductive reflowable material, or combinations of such.

主权项

1. A semiconductor device comprising:
a first die; a second die attached to the first die; a third die attached to the second die and located on an opposite side of the second die than the first die; wire bonds electrically connecting the third die to the first die; an encapsulant encapsulating the second die and the third die and in physical contact with a first surface of the first die; and first external connections extending into the encapsulant and in electrical connection with the third die.