| 发明名称 |
THERMALLY CONDUCTIVE POLYMER COMPOSITION AND THERMALLY CONDUCTIVE MOLDED OBJECT |
| 摘要 |
The present invention provides, as a thermally conductive polymer composition which has little fear of causing bubbles to come into thermally conductive molded objects to be formed, a thermally conductive polymer composition comprising thermally conductive inorganic particles having a specific particle size distribution and an electrical insulating polymer. |
| 申请公布号 |
WO2015166609(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
WO2014JP83294 |
申请日期 |
2014.12.16 |
| 申请人 |
NITTO DENKO CORPORATION;NITTO SHINKO CORPORATION |
发明人 |
FUJIKAWA KENICHI;HATAKEYAMA YOSHIHARU;YAMAGUCHI MIHO;YAMAGISHI YUJI;OOHASHI AKIHIRO |
| 分类号 |
C08L101/00;C08K3/38 |
主分类号 |
C08L101/00 |
| 代理机构 |
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