CHIP PACKAGING METHOD AND CHIP PACKAGE USING HYDROPHOBIC SURFACE

摘要

A chip packaging method using a hydrophobic surface comprises the following steps of: forming a superhydrophobic surface having a preset size on each of any one of a first chip and a first board and any one of a second chip and a second board; forming a hydrophilic surface at a preset position on the superhydrophobic surface formed on each of any one of the first chip and the first board and any one of the second chip and the second board; generating a liquid metal ball on the hydrophilic surface formed on each of any one of the first chip and the first board and any one of the second chip and the second board; and packaging any one of the first chip and the first board and any one of the second chip and the second board by coupling the liquid metal ball of any one of the first chip and the first board and the liquid metal ball of any one of the second chip and the second board.