| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition excellent not only in alkali developability and solder heat resistance but in storage stability, discoloration resistance to heat or light, and dry-to-touch property, and a dry film, a cured product, and a printed wiring board.SOLUTION: The curable resin composition comprises (A) a carboxyl group-containing resin, (B) a photopolymerization initiator, (C) a triglycidyl isocyanurate consisting of only a &bgr;-body having such a structure that three epoxy groups are bonded in the sane direction with respect to a S-triazine ring skeleton plane, and (D) an inorganic filler. An equivalent ratio of epoxy groups included in the (C) triglycidyl isocyanurate to 1 equivalent of the carboxyl group in the (A) carboxyl group-containing resin is 2.0 or less. |
