CONDUCTION COOLED MODULE

摘要

In one aspect, conduction cooled modules are described herein. In some implementations, a conduction cooled module comprises first and second external support structures arranged in facing opposition to one another, forming a component envelope therebetween. In some implementations, the modules are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.

主权项

1. A conduction cooled module comprising:
a first external support structure; a second external support structure in facing opposition to the first external support structure; and a component envelope defined by the first external support structure and the second external support structure and located between the first external support structure and the second external support structure,wherein the first external support structure and the second external support structure are configured to contact at least one cold plate and to retain at least one printed wiring board in the component envelope in between the first external support structure and the second external support structure.