| 摘要 |
This invention is provided with the following: a metal lead-out-wiring-layer pattern (207) that extends outside a light-emitting region of a substrate; a passivation layer (216), laid out so as to cover the lead-out-wiring-layer pattern (207), in which contact holes (216a) are provided outside the aforementioned region; a connecting-wiring-layer pattern (237) provided contiguously along the top surface of the passivation layer (216), the inside surfaces of the contact holes (216a), and the top surface of the lead-out-wiring-layer pattern (207) inside the contact holes (216a); a conductive sealing-layer pattern (217) that is laid out on top of the connecting-wiring-layer pattern (237) and covers the parts thereof located inside the contact holes (216a); a conductive upper sealing-layer pattern (219) that, with part thereof in contact with the aforementioned sealing-layer pattern (217), covers said sealing-layer pattern (217); and a contact-prevention-layer pattern (218, 236) interposed between the outside edge of the sealing-layer pattern (217) and the upper sealing-layer pattern (219). |
