SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, which can improve coatability of a process liquid with respect to a substrate while inhibiting an increase in manufacturing cost or device cost and inhibiting a decrease in yield.SOLUTION: A substrate processing apparatus 1 according to an embodiment comprises: a nozzle 11 for discharging a process liquid on a processed surface of a substrate W; a redirection part 6c having an inclined surface (redirection surface) 15 which is an annular inclined surface 15 for redirecting a traveling direction of the process liquid discharged by the nozzle 11 to make the process liquid be incident on the processed surface of the substrate W and which has an inclined angle that changes along a direction where the inclined surface extends annularly; and a nozzle rotation mechanism 7b or a nozzle rotation mechanism 7c which functions as a position change part for changing an incidence position of the process liquid on the inclined surface 15 of the substrate W to a direction where the inclined surface 15 extends annularly.