发明名称 MANUFACTURING METHOD OF CONDUCTIVE WIRING, AND CONDUCTIVE WIRING
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of conductive wiring capable of easily forming the conductive wiring with desired properties on an insulating substrate without supplying conductive paste to the insulation substrate by screen printing.SOLUTION: The manufacturing method of the conductive wiring includes the steps of: printing an ink 2 to be a predetermined pattern on an insulating substrate 1 (S1); placing (spraying) conductive powder 3 over the ink 2 (in the predetermined pattern) before drying the printed ink 2 (S2); pressing and compressing the placed conductive powder 3 on the insulating substrate 1 (S3); and heating and sintering the compressed conductive powder 3 (S4). Conductive wiring 20 is manufactures by a series of steps (S1-S4).
申请公布号 JP2015195329(A) 申请公布日期 2015.11.05
申请号 JP20140159588 申请日期 2014.08.05
申请人 SHUHO:KK 发明人 MURAOKA KOJI
分类号 H05K3/10 主分类号 H05K3/10
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