| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-carrying metal oxide particle which can be used suitably for polishing an aluminum disk, a silicon semiconductor wafer, and a compound semiconductor wafer or the like, and a production method thereof.SOLUTION: This invention provides a metal-carrying metal oxide particle in which a metal oxide particle with an average particle diameter in the range of 7-600 nm carries at least one metal selected from Ag, Pd, Au, Pt, Cu, and Fe in the range of 0.01-1200 pts. wt. as metal relative to the metal oxide particle of 100 pts. wt. |
