ULTRATHIN MICROELECTRONIC DIE PACKAGES AND METHODS OF FABRICATING THE SAME

摘要

Ultrathin microelectronic die packages and methods of fabricating the same comprising attaching a microelectronic die to a substrate with a plurality of interconnects, and depositing an underfill material between the microelectronic die and the microelectronic substrate, and around the interconnects. An etchant may be introduced to a back surface of the microelectronic die to remove a portion thereof which reduces the thickness of the microelectronic die to form an ultrathin microelectronic die. In another embodiment, the etching of the microelectronic die forms an ultrathin microelectronic die having a curved surface between the ultrathin microelectronic die back surface and a sidewall thereof.

主权项

1. A method of fabricating an ultrathin microelectronic package, comprising:
forming a microelectronic substrate having a first surface; attaching a microelectronic die to the microelectronic substrate with interconnects extending from a first surface of the microelectronic die to the microelectronic substrate first surface; depositing an underfill material between the microelectronic die and the microelectronic substrate, and around the interconnects; and introducing an etchant to a back surface of the microelectronic die to remove a portion thereof.