发明名称 SWITCH CIRCUIT PACKAGE MODULE
摘要 A switch circuit package module includes a semiconductor switch unit and a capacitor unit. The semiconductor switch unit includes a first semiconductor switch element and a second semiconductor switch element. The first semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The second semiconductor switch element includes sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode. The capacitor unit includes a plurality of capacitors. The semiconductor switch unit includes a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element.
申请公布号 US2015318242(A1) 申请公布日期 2015.11.05
申请号 US201514798484 申请日期 2015.07.14
申请人 Delta Electronics (Shanghai) Co., Ltd. 发明人 LI Zeng;HONG Shou-Yu;ZENG Jian-Hong
分类号 H01L23/522;H01L27/088 主分类号 H01L23/522
代理机构 代理人
主权项 1. A switch circuit package module, comprising: at least a semiconductor switch unit comprising: a first semiconductor switch element comprising a plurality of parallel connected sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode; anda second semiconductor switch element comprising a plurality of parallel connected sub micro-switch elements, each sub micro-switch element configured with a drain electrode and a source electrode; and at least a capacitor unit comprising a plurality of capacitors; wherein the semiconductor switch unit comprises a plurality of common electrodes, each common electrode connects the source electrode of one sub micro-switch element in the first semiconductor switch element with the drain electrode of one sub micro-switch element in the second semiconductor switch element and is disposed adjacent to at least one drain electrode from the first semiconductor switch element or one source electrode from the second semiconductor switch element, such that when the capacitors are configured to cooperate with the sub micro-switch element, impedances of multiple commutation loops between the capacitors and the sub micro-switch element are close to or the same with each other.
地址 Shanghai CN