ALUMINUM CLAD COPPER STRUCTURE OF AN ELECTRONIC COMPONENT PACKAGE

摘要

An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.

主权项

1. An electronic component package, comprising:
a package substrate, wherein the package substrate includes:
a dielectric layer;an aluminum clad copper structure attached to the dielectric layer, the aluminum clad copper structure includes an aluminum bond pad surface; an electronic component attached to the package substrate, the electronic component including an electrically conductive structure electrically coupled to the aluminum bond pad surface; an encapsulant, the encapsulant encapsulating the electronic component and at least a portion of the package substrate, wherein the encapsulant encapsulates the aluminum bond pad surface.