| 发明名称 |
WAFER HAVING PAD STRUCTURE |
| 摘要 |
A wafer including a substrate having a plurality of integrated circuits formed above the substrate, and at least one scribe line between two of the integrated circuits. The wafer further includes a plurality of dielectric layers formed in the at least one scribe line having a process control monitor (PCM) pad structure formed therein, the PCM pad structure having: a plurality of metal pads interconnected by a plurality of conductive vias. The PCM pad further includes a plurality of contact bars in contact with a bottom-most metal pad, the contact bars extending substantially vertically from the bottom-most metal pad into the substrate. Additionally, the PCM pad includes an isolation structure substantially surrounding the plurality of contact bars to isolate the PCM pad structure. |
| 申请公布号 |
US2015318225(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201514798857 |
申请日期 |
2015.07.14 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN Ying-Ju;CHEN Hsien-Wei;TSAI Hao-Yi;LII Mirng-Ji |
| 分类号 |
H01L21/66;H01L23/522;H01L23/00;H01L23/532;H01L29/06;H01L23/538;H01L23/50;H01L23/528 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer comprising:
a substrate having a plurality of integrated circuits formed above the substrate, and at least one scribe line between two of the integrated circuits; and a plurality of dielectric layers formed in the at least one scribe line having a process control monitor (PCM) pad structure formed therein, the PCM pad structure having:
a plurality of metal pads interconnected by a plurality of conductive vias;a plurality of contact bars in contact with a bottom-most metal pad, the contact bars extending substantially vertically from the bottom-most metal pad into the substrate; andan isolation structure substantially surrounding the plurality of contact bars to isolate the PCM pad structure. |
| 地址 |
Hsinchu TW |
