De-Embedding On-Wafer Devices

摘要

An apparatus includes three components. The first component includes a first transmission line; the second component is coupled with the first component and includes a second transmission line; and the third component electrically coupled with the first component and/or the second component. The transmission lines each include a substrate with a p-well or n-well within the substrate and a shielding layer over the p-well or n-well. The transmission lines also each include a plurality of intermediate conducting layers over the shielding layer, the plurality of intermediate conducting layers coupled by a plurality of vias. The transmission lines further each include a top conducting layer over the plurality of intermediate conducting layers.

主权项

1. An apparatus comprising:
a first component including a first transmission line; a second component coupled with the first component, wherein the second component includes a second transmission line; and a third component electrically coupled with the first component and/or the second component, wherein the first transmission line and the second transmission line are each comprised of:
a substrate;a p-well or n-well within the substrate;a shielding layer over the p-well or n-well;a plurality of intermediate conducting layers over the shielding layer, the plurality of intermediate conducting layers coupled by a plurality of vias; anda top conducting layer over the plurality of intermediate conducting layers.