Force sensor

摘要

The sensor (10) has a piezo-resistive element (40) on a semiconductor main portion (30) connected to a substrate (20) in a force-fit manner. A wing (50) is connected to semiconductor main portion. The wings (50,60) are provided with force application areas (59,69). The piezo-resistive element is positioned between the wings. A force distribution component (70) is connected to force application areas (59,69). The force distribution component is formed with a surface oriented away from top of semiconductor main portion and provided with a force application area (79).