发明名称 |
METHOD OF FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE FABRICATED BY THE SAME METHOD |
摘要 |
The present disclosure is directed to a method of fabricating a substrate structure and a substrate structure fabricated by the same method. The method would include forming a first metal layer directly on a base, forming a second metal layer directly on the first metal layer, forming a first protective layer by using a compound comprising a thiol group directly on the second metal layer, patterning the first protective layer to form at least one opening exposing the second metal layer, and forming a third metal layer within the at least one opening of the first protective layer and directly on the second metal layer. The substrate structure would include a base, a first metal layer, a second metal layer, a first protective layer, at least one opening, and a third metal layer. |
申请公布号 |
EP2940528(A1) |
申请公布日期 |
2015.11.04 |
申请号 |
EP20150165648 |
申请日期 |
2015.04.29 |
申请人 |
WISTRON NEWEB CORPORATION |
发明人 |
RADI, BABAK;CHEN, SHIH-HONG;KUO, YU-FU;CHEN, CHUN-LIN;CHEN, JING-WEN |
分类号 |
G03F7/20;B32B3/02;B32B3/30;B32B15/04;B32B15/08;B32B15/20;C23C18/16;C23C18/18;H01L23/06;H01Q1/22 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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