发明名称 CURABLE RESIN COMPOSITION
摘要 <p>The present invention is a curable resin composition comprising a copolymer (A) represented by the following general formula (1), silica fine particles (B), a reactive monomer (C) and a polymerization initiator (D). In the general formula (1), X is an atomic group formed by removing "k" mercapto groups from a multifunctional thiol compound having at least "k" mercapto groups; Y is a monovalent organic group derived from a copolymer formed by copolymerizing unsaturated monomers; and "k" is an integer of 3 to 10. The present invention can provide a hard coat agent which has low curing shrinkage and which has both low curing shrinkage and antiblocking properties as needed; a hard coat film and a hard-coat treated plastic substrate having high pencil hardness and low curling properties, by using this hard coat agent. €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ€ƒX- (5S-Y) k €ƒ€ƒ€ƒ€ƒ€ƒ(1)</p>
申请公布号 EP2644631(A4) 申请公布日期 2015.11.04
申请号 EP20110843403 申请日期 2011.11.08
申请人 SHOWA DENKO K.K. 发明人 DOI, MITSURU;YASUI, YOSHIKATSU;ISHII, NOBUAKI;OHTAKE, ISAO;URAKAWA, KATSURO;OI, HIROKO;HATTORI, YOTARO
分类号 C08F290/12;C08F283/00;C08F283/01;C08K3/36;C09D4/00;C09D4/02;C09D157/06;C09D181/02 主分类号 C08F290/12
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