| 摘要 |
The present invention relates to a bonding system of a light emitting device and a bonding method of the light emitting device, capable of attaching a solder on a substrate and bonding the light emitting device. The bonding system of the light emitting device includes a substrate transfer apparatus which transfers the substrate to a first standby place, a solder cake attaching apparatus which prints a temporary surface with solder paste, bakes the printed solder paste with a solder cake state, and attaches the solder cake to the bonding point of the substrate which is transferred to the first standby place, and a light emitting device attaching apparatus which attaches the light emitting device on the solder cake to receive the light emitting device on the solder cake. |
