发明名称 COPPER ALLOY AND METHOD FOR PRODUCING COPPER ALLOY
摘要 [Problem to be Solved] The present invention provides a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. [Solution] Provided is a copper alloy having a composition represented by the composition formula by atom%: Cu 100-a-b-c (Zr, Hf) a (Cr, Ni, Mn, Ta) b (Ti, Al) c [wherein 2.5 ‰¤ a ‰¤ 4.0, 0.1 < b ‰¤ 1.5 and 0 ‰¤ c ‰¤ 0.2; (Zr, Hf) means one or both of Zr and Hf; (Cr, Ni, Mn, Ta) means one or more of Cr, Ni, Mn and Ta; and (Ti, Al) means one or both of Ti and Al], and having Cu primary phases in which the mean secondary dendrite arm spacing is 2 µm or less and eutectic matrices in which the lamellar spacing between a metastable Cu 5 (Zr, Hf) compound phase and a Cu phase is 0.2 µm or less.
申请公布号 EP2692877(B1) 申请公布日期 2015.11.04
申请号 EP20120765315 申请日期 2012.03.29
申请人 TOHOKU UNIVERSITY 发明人 INOUE, AKIHISA;NISHIYAMA, NOBUYUKI;YAMAZAKI, HARUKO
分类号 C22C9/00;C22C9/01;C22C9/05;C22C9/06;C22F1/00;C22F1/08 主分类号 C22C9/00
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