| 摘要 |
<p>A manifold for a heating and/or cooling apparatus comprising a first conduit and a second conduit, wherein the second conduit is beatable within the first conduit and wherein the first conduit and/or the second conduit are at least partially resilient, and wherein the first conduit is sealed at one end thereof and the first and second conduits are configurable such that a fluid flow path exists between the first and second conduits, and wherein the first conduit includes one or more thermal transfer points.</p> |
