| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a crack from progressing around a metal bump when ultrasonic bonding of the metal bump onto an electrode pad in a package is performed, even if there is a crack at the end of a piezoelectric vibration piece.SOLUTION: A piezoelectric wafer 1 has a piezoelectric vibration piece 2, a frame 3 for supporting the piezoelectric vibration piece, and a coupling 4 for coupling the piezoelectric vibration piece to the frame. A pair of metal bumps 11a, 11b for external bonding are juxtaposed on the piezoelectric vibration piece 2. Slits 13a, 13b extending in the width direction are formed in the coupling, excepting a bridge 13c that is a portion in the width direction, and the end of the bridge in the width direction is separated from both metal bumps, in a direction perpendicular to the width direction, and is not superposed on both metal bumps.</p> |
