IMAGE MODULE

摘要

The invention relates to an image module comprised of the following principal elements: a module board with an image sensor that is mounted thereon or on the rear side thereof by means of flip-chip technology. The aim of the invention is to create an image module in which a simple, precise and rapid mounting of the functional assemblies with the precise allocation of the distance between the surface of the image sensor and the lens system is made possible. To this end, the invention provides that three interspaced spacer elements ( 9 ) are placed between the module board ( 2 ) and the covering element ( 7 ). These spacer elements define the distance between the image sensor ( 3 ) on the module board ( 2 ) by defining a predetermined air gap ( 11 ).