发明名称 金属張積層板の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a metal-clad laminated sheet having superior hygroscopic solder heat resistance. <P>SOLUTION: The method of manufacturing the metal-clad laminated sheet including at least two or more kinds of polyimide layers on a conductor is provided, in which a layer that is in contact with a conductor of the at least two or more kinds of polyimide layer is a thermoplastic polyimide layer, and the thermoplastic polyimide has the main components of pyromellitic dianhydride and 2,2-bis-[4-(4-aminophenoxy)phenyl]propane, and satisfies a specific condition. The method includes a step of casting two or more kinds of solutions including a precursor of a polyimide resin on the conductor by coextrusion to form a plurality of layers of two or more layers. A chemical dehydrating agent and a catalyst are included in at least one solution out of the solutons used in the coextrusion. The polyimide precursor is imidized at a temperature of 310 to 410°C. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5804830(B2) 申请公布日期 2015.11.04
申请号 JP20110167413 申请日期 2011.07.29
申请人 株式会社カネカ 发明人 近藤 康孝;金城 永泰
分类号 B29C47/06;B32B15/08;B32B27/34;H05K1/03 主分类号 B29C47/06
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