| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module substrate in which the amount of deflection is small, and jointing to a heatsink is easy. <P>SOLUTION: In the method of manufacturing a power module substrate, on both surfaces of a ceramic substrate, a metal plate for a circuit layer and a metal plate for a heat radiation layer which is thicker than the metal plate for a circuit layer are stacked in a thickness direction, with solder material interposed in between, to form a substrate laminate. The substrate laminate is sandwiched between a first pinching body which is made from carbon plate material having thickness 0.5 mm or more and 5.0 mm or less and a plate-like second pinching body comprising a graphite sheet of thickness 0.2 mm or more and 4.0 mm or less and two carbon plates having thickness 0.5 mm or more and 5.0 mm or less which are laminated with the graphite sheet in between, which are then applied with pressure in a stacking direction while being heated, so that the ceramic substrate and the respective metal plates of the substrate laminate are soldered. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
