| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a supply method and a supply device of polishing slurry in which coarse particles becoming the cause of defect when polishing a wafer are reduced significantly, and defects of nano-order on the wafer surface can be reduced when polishing a wafer, and to provide a polishing apparatus. <P>SOLUTION: The method of supplying the polishing slurry produced by mixing an undiluted slurry solution and pure water to a polishing apparatus includes a step for mixing the undiluted slurry solution and pure water while controlling so that a predetermined amount of pure water per unit time is added to a measured undiluted slurry solution, and a step for supplying the polishing slurry thus mixed to the polishing apparatus. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
