Circuit module including duplexer

摘要

A circuit module includes a duplexer mounted on a module board and a cover layer is stacked on an insulating layer that is disposed on one principal surface of a device board so as to enclose a predetermined area thereof. A transmission filter device and a reception filter device that have different transmission bands are provided on the one principal surface of the device board in the predetermined area thereof within the space enclosed by the insulating layer between the device board and the cover layer. Accordingly, the duplexer does not include a package board as in the existing technique, and in turn a circuit module including the duplexer mounted on the module board is significantly reduced in height and in size.

主权项

1. A circuit module, comprising:
a device board; an insulating layer arranged on one principal surface of the device board so as to enclose a predetermined area thereof; a cover layer stacked on the insulating layer so as to provide a space enclosed by the insulating layer between the cover layer and the device board; a duplexer including a first filter device and a second filter device, the first and second filter devices having different transmission bands, and the first and second filter devices being provided in the predetermined area within the space; a module board, on which the duplexer is mounted; a first circuit element provided in the cover layer, the first circuit element being connected to the first filter device or the second filter device; a second circuit element provided in or on the module board, the second circuit element being connected to the first filter device or the second filter device; and the cover layer includes a plurality of a resin layers stacked on each other, and an electrode pattern defining the first circuit element provided on each of the plurality of the resin layers.