| 发明名称 | Chip mounting | ||
| 摘要 | A device comprising a chip including a substrate defining one or more electronic devices and a printed circuit board electrically connected to the chip via one or more solder elements sandwiched between the chip and the printed circuit board, and the solder elements, said buffer layers having a Young's Modulus of 2.5GPa or less. | ||
| 申请公布号 | US9177885(B2) | 申请公布日期 | 2015.11.03 |
| 申请号 | US200712518262 | 申请日期 | 2007.11.26 |
| 申请人 | Cambridge Silicon Radio Limited | 发明人 | Stacey Simon Jonathan |
| 分类号 | H01L23/32;H01L23/31;H01L23/28;H01L23/532;H01L23/29;H01L23/00 | 主分类号 | H01L23/32 |
| 代理机构 | Vorys, Sater, Seymour and Pease LLP | 代理人 | Vorys, Sater, Seymour and Pease LLP ;DeLuca Vincent M |
| 主权项 | 1. A chip including a substrate defining one or more electronic devices and one or more solder elements located within the area of the chip and electrically connected to said one or more electronic devices, wherein the chip is provided with two impact resisting buffer layers between the substrate and the solder elements and a patterned conductive layer sandwiched between the said buffer layers for electrically connecting said one or more solder elements to said one or more electronic devices, said buffer layers each having a Young's Modulus in the range of 1.6GPa to 2.4GPa, wherein the buffer layer between the substrate and the patterned conductive layer has a thickness in the range from 7 to 8 microns. | ||
| 地址 | Cambridge GB | ||