发明名称 |
High-frequency semiconductor package and high-frequency semiconductor device |
摘要 |
Certain embodiments provide a high-frequency semiconductor package including: a base which is made of metal and is a grounding portion; a multi-layer wiring resin substrate; a first internal conductor film; and a lid. The multi-layer wiring resin substrate is provided on a top surface of the base, and has a frame shape in which a first cavity from which the top surface of the base is exposed is formed. The first internal conductor film covers surfaces which form a top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base. The lid is attached onto the multi-layer wiring resin substrate, and seals and covers the first cavity. |
申请公布号 |
US9177881(B2) |
申请公布日期 |
2015.11.03 |
申请号 |
US201314093849 |
申请日期 |
2013.12.02 |
申请人 |
Kabushiki Kaisha Toshiba |
发明人 |
Ikuma Yoshiyuki;Suzuki Masatoshi |
分类号 |
H01L23/10;H01L23/552;H01L23/66;H01L23/045;H01L23/20 |
主分类号 |
H01L23/10 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A high-frequency semiconductor package comprising:
a base which is made of metal and is a grounding portion; a frame-shaped multi-layer wiring resin substrate which is provided on a top surface of the base and in which a first cavity from which the top surface of the base is exposed is formed, wherein the frame-shaped multi-layer wiring resin substrate includes an internal electrode which is formed on a top surface of the multi-layer wiring resin substrate, an external connection terminal which is formed on a bottom surface of the multi-layer wiring resin substrate so as to be insulated from the base, and a through-hole which electrically connects the internal electrode and the external connection terminal; a first internal conductor film which covers the top surface of the multi-layer wiring resin substrate and an inner wall surface of the first cavity, and is electrically connected with the base; a lid which is attached onto the multi-layer wiring resin substrate and seals and covers the first cavity; a first groove which is provided from a lateral surface of the external connection terminal to a lateral surface of the multi-layer wiring resin substrate; and a first lateral surface conductor film which is provided in the first groove, wherein the first lateral surface conductor film is provided to be insulated from the first internal conductor film. |
地址 |
Minato-ku JP |