External gettering method and device

摘要

Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

主权项

1. An external gettering element for providing gettering to a first substrate of a semiconductor device, said first substrate having a front side at which electrical devices are formed and a stress relieved backside opposite the front side, said external gettering element comprising:
a first gettering material, wherein said first gettering material contains an additive which provides the first gettering material with ions, the ions provided by the additive having the property of attracting ions and/or contaminants contained within the first substrate away from the front side; and a first adhesive material for adhering said first gettering material to the backside of the first substrate.