发明名称 |
NH3 containing plasma nitridation of a layer of a three dimensional structure on a substrate |
摘要 |
Methods and apparatus for forming nitrogen-containing layers are provided herein. In some embodiments, a method includes placing a substrate having a first layer disposed thereon on a substrate support of a process chamber; heating the substrate to a first temperature; and exposing the first layer to an RF plasma formed from a process gas comprising ammonia (NH3) to transform the first layer into a nitrogen-containing layer, wherein the plasma has an ion energy of less than about 8 eV. |
申请公布号 |
US9177787(B2) |
申请公布日期 |
2015.11.03 |
申请号 |
US201414195273 |
申请日期 |
2014.03.03 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
Guarini Theresa Kramer;Liu Wei |
分类号 |
H01L21/02;C23C16/56 |
主分类号 |
H01L21/02 |
代理机构 |
Moser Taboada |
代理人 |
Moser Taboada ;Taboada Alan |
主权项 |
1. A method of forming a nitrogen-containing layer, comprising:
placing a substrate having a first layer disposed thereon on a substrate support of a process chamber, wherein the first layer is a 3-dimensional structure; heating the substrate to a first temperature of about 250 degrees Celsius to about 500 degrees Celsius; and exposing the first layer to an RF plasma formed from a process gas comprising ammonia (NH3) to transform the first layer into the nitrogen-containing layer, wherein the process gas comprises about 0.5% to about 99.5% ammonia (NH3) based on total gas flow and the balance is a noble gas, and wherein the plasma has an ion energy of less than about 8 eV, and wherein an amount of nitrogen incorporated in a top surface of the nitrogen-containing layer is substantially equal to an amount of nitrogen incorporated down a sidewall of the nitrogen-containing layer. |
地址 |
Santa Clara CA US |