| 发明名称 | Polishing apparatus with polishing head cover | ||
| 摘要 | A polishing apparatus is used for polishing a substrate such as a semiconductor. The polishing apparatus includes a polishing table configured to hold a polishing tool having a polishing surface, a polishing head having a top ring configured to press a substrate against the polishing surface, and a polishing head cover configured to cover the polishing head. The polishing apparatus further includes a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover, and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover. | ||
| 申请公布号 | US9174324(B2) | 申请公布日期 | 2015.11.03 |
| 申请号 | US201414167941 | 申请日期 | 2014.01.29 |
| 申请人 | Ebara Corporation | 发明人 | Umemoto Masao;Sone Tadakazu;Kosuge Ryuichi;Aizawa Hideo |
| 分类号 | B24B37/34;B24B37/10;B24B53/017 | 主分类号 | B24B37/34 |
| 代理机构 | Baker & Hostetler LLP | 代理人 | Baker & Hostetler LLP |
| 主权项 | 1. A polishing apparatus comprising: a polishing table configured to hold a polishing tool having a polishing surface; a polishing head having a top ring configured to press a substrate against the polishing surface; a polishing head cover configured to cover the polishing head; a first cleaning liquid supply mechanism configured to supply a cleaning liquid to an outer surface of the polishing head cover; and a second cleaning liquid supply mechanism configured to supply a cleaning liquid to an inner surface of the polishing head cover. | ||
| 地址 | Tokyo JP | ||