发明名称 Semiconductor device and semiconductor device production system
摘要 A semiconductor device production system using a laser crystallization method is provided which can avoid forming grain boundaries in a channel formation region of a TFT, thereby preventing grain boundaries from lowering the mobility of the TFT greatly, from lowering ON current, and from increasing OFF current. Rectangular or stripe pattern depression and projection portions are formed on an insulating film. A semiconductor film is formed on the insulating film. The semiconductor film is irradiated with continuous wave laser light by running the laser light along the stripe pattern depression and projection portions of the insulating film or along the major or minor axis direction of the rectangle. Although continuous wave laser light is most preferred among laser light, it is also possible to use pulse oscillation laser light in irradiating the semiconductor film.
申请公布号 US9178069(B2) 申请公布日期 2015.11.03
申请号 US200912533401 申请日期 2009.07.31
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Isobe Atsuo;Yamazaki Shunpei;Dairiki Koji;Shibata Hiroshi;Kokubo Chiho;Arao Tatsuya;Hayakawa Masahiko;Miyairi Hidekazu;Shimomura Akihisa;Tanaka Koichiro;Akiba Mai
分类号 H01L21/268;H01L29/786;H01L21/3213;H01L21/02;B23K26/073;H01L21/20;H01L21/84;H01L29/66;H01L27/12 主分类号 H01L21/268
代理机构 Robinson Intellectual Property Law Office, P.C. 代理人 Robinson Eric J.;Robinson Intellectual Property Law Office, P.C.
主权项 1. A method for manufacturing a semiconductor device comprising: forming an insulating film over an insulating substrate; selectively etching the insulating film to form a plurality of projection portions, wherein each of the plurality of projection portions has a rectangular or stripe pattern; forming a semiconductor film so as to cover the plurality of projection portions; irradiating the semiconductor film with a laser light; and removing a portion of the semiconductor film so that a plurality of semiconductor islands is formed between each of the plurality of projection portions after the irradiating step.
地址 Atsugi-shi, Kanagawa-ken JP