Nitride semiconductor device

摘要

A nitride semiconductor device includes first electrode interconnect layers and second electrode interconnect layers formed over a nitride semiconductor layer, a first insulating film formed on the first and second electrode interconnect layers and including first openings, first interconnect layers and second interconnect layers formed on the first insulating film and respectively connected to the first electrode interconnect layers and the second electrode interconnection layers through the first openings, a second insulating film formed on the first and second interconnect layers and including second openings, and a first pad layer and a second pad layer formed on the second insulating film and respectively connected to the first interconnect layers and the second interconnect layers through the second openings.

主权项

1. A nitride semiconductor device comprising:
a substrate; a nitride semiconductor layer formed over the substrate and including an active region; first electrode interconnect layers and second electrode interconnect layers alternately spaced from one another over the active region of the nitride semiconductor layer; a first insulating film formed on the first and second electrode interconnect layers, and including a plurality of first openings through which the first and second electrode interconnect layers are exposed; first interconnect layers and second interconnect layers alternately spaced from one another on the first insulating film, the first interconnect layers being in electrical connection to the first electrode interconnect layers through associated ones of the first openings and extending in a direction intersecting with the first electrode interconnect layers, the second interconnect layers being in electrical connection to the second electrode interconnect layers through associated ones of the first openings and extending in a direction intersecting with the second electrode interconnect layers; a second insulating film formed on the first and second interconnect layers, and including a plurality of second openings through which the first and second interconnect layers are exposed; and a first pad layer and a second pad layer spaced from each other on the second insulating film and located above the active region, the first pad layer being in electrical connection to the first interconnect layers through associated ones of the second openings, the second pad layer being in electrical connection to the second interconnect layers through associated ones of the second openings.