FBRICATING METHOD OF CHIP OPEN MOLDING PACKAGE

摘要

A method for manufacturing a chip-open molding package is disclosed. The method for manufacturing a chip-open molding package comprises the steps of: forming a dam in the shape of surrounding an open molding area between the open molding area and bonding pads on the front face of a semiconductor chip on which the open molding area is formed at the center portion thereof and the bonding pads are formed at a peripheral portion thereof; attaching the rear face of the semiconductor chip opposed to the front face, onto the upper face of a substrate on which connection pads are formed; forming conductive wires of connecting the bonding pads of the semiconductor chip to the connection pads of the substrate; and forming a mold portion which exposes the open molding area, and surrounds the conductive wires by using a mold preventing sealing material from flowing into the open molding area as coming in close contact with the upper face of the dam.