Pattern inspection method and pattern inspection apparatus

摘要

In accordance with an embodiment, a pattern inspection method includes applying a light to a substrate including an inspection target pattern in a plurality of optical conditions, detecting a reflected light from the substrate to acquire a pattern image for each of the optical conditions, outputting a gray value difference between the pattern image and a reference image for each of the optical conditions, and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the optical conditions. The pattern is formed by a stacked film, the optical conditions includes at least a first optical condition for detection of a defect on a surface of the stacked film.

主权项

1. A pattern inspection method comprising:
applying a light to a substrate under a plurality of optical conditions which are different from each other, the substrate comprising an inspection target pattern in which a stacked film is formed; detecting a reflected light from the substrate to acquire a pattern image for each of the different optical conditions; outputting a gray value difference between the pattern image and a reference image for each of the different optical conditions; and specifying a position of the defect in a stacking direction of the stacked film from a relation of the obtained gray value difference between the different optical conditions, wherein the optical conditions comprise at least one of a wavelength, a focus position, and a polarized light.