发明名称 Microfluidic die with a high ratio of heater area to nozzle exit area
摘要 The present disclosure is directed to a microfluidic die having a substrate with an inlet path that is configured to move fluid into the die. The die includes a plurality of heaters formed above the substrate, each heater having a first area, a plurality of chambers formed above the plurality of heaters, and a plurality of nozzles formed above the chambers. Each nozzle having an entrance adjacent to the chamber and an exit adjacent to en external environment, the entrance having a second area, and the second having a third area, the first area being greater than the second area, and the second area being greater than the third area. A ratio of the first area to the third area being greater than 5 to 1.
申请公布号 US9174445(B1) 申请公布日期 2015.11.03
申请号 US201414310633 申请日期 2014.06.20
申请人 STMicroelectronics S.r.l.;STMicroelectronics, Inc. 发明人 Prati Daniele;Giusti Domenico;Dodd Simon
分类号 B41J2/05;B41J2/14;B41J2/16 主分类号 B41J2/05
代理机构 Seed IP Law Group PLLC 代理人 Seed IP Law Group PLLC
主权项 1. A device, comprising: a substrate; a plurality of heaters on the substrate, each heater having a heater area; a plurality of nozzles disposed above the heaters, each nozzle having an entrance and an exit, each entrance being closer to a heater than the exit, the exit having a first nozzle area, a ratio of the heater area to the first nozzle area being greater than 9 to 1; and a plurality of chambers disposed between the heaters and the nozzles.
地址 Agrate Brianza IL