Imaging device

摘要

A solid state imaging device according to an embodiment includes a photo detector arranged two-dimensionally in a semiconductor substrate, a readout circuit provided in the semiconductor substrate, a first photoelectric conversion layer provided above the photo detector, a plurality of first metal dots provided above the first photoelectric conversion layer, a second photoelectric conversion layer provided above the first metal dots, and a plurality of second metal dots provided above the second photoelectric conversion layer.

主权项

1. An imaging device, comprising:
a photo detector provided in a semiconductor substrate; a first photoelectric conversion layer provided above the photo detector; a plurality of first metal dots provided above the first photoelectric conversion layer; a second photoelectric conversion layer provided above the first metal dots; and a plurality of second metal dots provided above the second photoelectric conversion layer, wherein each of the first and second metal dots includes an upper metal member and a lower metal member each having a different width, and a width of the upper metal member of one of the first and second metal dots, which is more distant from a face from which light is incident, is the same as a width of the lower metal member of the other, which is closer to the face from which light is incident.