Chip-on-film package and device assembly including the same

摘要

Chip-on-film packages and device assemblies including the same may be provided. The device assembly includes a film package including a semiconductor chip, a panel substrate connected to one end of the film package, a display panel disposed on the panel substrate, and a controlling part connected to another end of the film package. The film package includes a film substrate, a first wire disposed on a top surface of the film substrate, and a second wire disposed on a bottom surface of the film substrate.

主权项

1. A device assembly comprising:
a film package including,
a semiconductor chip,a film substrate having a U-shape at at least one end thereof,a first wire on a top surface of the film substrate, the first wire including a first portion and a second portion spaced apart from the first portion to expose a portion of the film substrate therebetween, anda second wire on a bottom surface of the film substrate; a panel substrate connected to one end of the film package; and a display panel on the panel substrate, wherein the first portion of the first wire is adjacent to a bottom surface of the panel substrate and the second portion of the first wire is adjacent to a top surface of the panel substrate.