Enhanced flip-chip die architecture

摘要

A method of assembling a multi-chip electronic device into a thin electronic package entails inverting a flip-chip die arrangement over a hollow substrate, stacking additional dies on the hollow substrate to form a multi-chip electronic device, and encapsulating the multi-chip electronic device. Containment of the encapsulant can be achieved by joining split substrate portions, or by reinforcing a hollow unitary substrate, using a removable adhesive film. Use of the removable adhesive film facilitates surrounding the multi-chip electronic device with the encapsulant. The adhesive film can also prevent encapsulant from creeping around the substrate to an underside of the substrate that supports solder ball pads for subsequent attachment to a ball grid array (BGA) or a land grid array (LGA).

主权项

1. A method of packaging a multi-chip electronic device, the method comprising:
fabricating a split substrate having left and right substrate portions spaced apart from one another by a gap; joining the left and right substrate portions by attaching an adhesive to an underside of each substrate portion to bridge the gap and to cover solder ball pads located on the undersides of the split substrate; joining a plurality of integrated circuit chips to each other using a flip-chip die attach process; attaching a pair of the plurality of integrated circuit chips to the split substrate to form a multi-chip electronic device in which one chip is suspended within the gap, a lower surface of the suspended chip being held substantially above the undersides of the split substrate so a not to contact the adhesive; wire-bonding one or more of the pair of the plurality of integrated circuit chips to the split substrate; encapsulating the multi-chip electronic device with the adhesive present to protect the solder ball pads from coming into contact with an encapsulant; removing the adhesive from the right and left substrate portions; and attaching solder balls to surfaces of the protected solder ball pads.