Semiconductor test device and method for fabricating the same

摘要

Semiconductor test devices and methods for fabricating the same may be provided. The semiconductor test device may include a first thermal test flip chip cell including a first heater and a first sensor, and a test substrate formed under the first thermal test flip chip cell. The first thermal test flip chip cell may include a plurality of first bumps arranged on a bottom surface of the first thermal test flip chip cell and be configured to be electrically connected to the first heater and the first sensor. The test substrate may include a first ball array arranged on a bottom surface of the test substrate in a first direction and be configured to be electrically connected to the plurality of first bumps, which are electrically connected to the first heater and the first sensor.

主权项

1. A semiconductor test device comprising:
a first thermal test flip chip cell including a first heater and a first sensor, the first thermal test flip chip cell including a plurality of first bumps arranged on a bottom surface thereof, the plurality of first bumps configured to electrically connect to the first heater and the first sensor; and a test substrate under the first thermal test flip chip cell, the test substrate including a first ball array arranged on a bottom surface thereof in a first direction, the first ball array configured to electrically connect to the plurality of first bumps.