| 发明名称 | Resin composition and method for producing circuit board | ||
| 摘要 | The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)). | ||
| 申请公布号 | US9175151(B2) | 申请公布日期 | 2015.11.03 |
| 申请号 | US201414496709 | 申请日期 | 2014.09.25 |
| 申请人 | PANASONIC CORPORATION | 发明人 | Konno Yuko;Takashita Hiromitsu;Takeda Tsuyoshi;Fujiwara Hiroaki;Yoshioka Shingo |
| 分类号 | C08K5/34;H05K1/03;H05K3/00;C09D125/08;C09D133/08;C08K5/3475;H05K3/10;H05K3/18;C08L33/02;C08K5/00 | 主分类号 | C08K5/34 |
| 代理机构 | McDermott Will & Emery LLP | 代理人 | McDermott Will & Emery LLP |
| 主权项 | 1. A resin composition comprising: a copolymer comprising of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer; and an ultraviolet absorber, wherein, when the resin composition forms a resin film and when ∈1 represents an absorbance coefficient per unit weight of a resin film in a solution prepared by dissolving the resin film in a solvent, ∈1 at a light wavelength at which the resin film is to be irradiated is at least 0.01 (L/(g·cm)), and wherein the resin film has acid resistance and swells or dissolves in an alkaline solution. | ||
| 地址 | Osaka JP | ||