A LED PACKAGE AND A LED PACKAGE MANUFACTURING METHOD

摘要

The present invention relates to an LED package, and a manufacturing method thereof. The manufacturing method of the LED package comprises: a first step of bonding an LED chip to a substrate; a second step of coating a resin with a transparent material on an upper part of an assembly assembled in the first step; a third step of coating a resin with a transparent material including a fluorescent material on an upper part of an assembly in the second step; and a fourth step of curing the resin to be fixated on the assembly.