发明名称 Light emitting device having interstitial elements in grain boundaries of barrier layer
摘要 A light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, and an electrode on at least one of the first conductive semiconductor layers or the second semiconductor layer. The electrode includes an adhesive layer on the light emitting structure, a barrier layer on the adhesive layer, and a bonding layer on the barrier layer. The barrier layer includes a plurality of grain boundaries, and the grain boundaries include interstitial elements.
申请公布号 US9178117(B2) 申请公布日期 2015.11.03
申请号 US201314057341 申请日期 2013.10.18
申请人 LG Innotek Co., Ltd. 发明人 Kang Han Byul
分类号 H01L27/15;H01L29/165;H01L31/12;H01L33/00;H01L27/14;H01L31/0232;H01L23/48;H01L23/52;H01L29/40;H01L33/44;H01L21/285;H01L33/40;H01L21/02;H01L21/768;H01L23/532;H01L49/02;H01L33/32 主分类号 H01L27/15
代理机构 KED & Associates LLP 代理人 KED & Associates LLP
主权项 1. A light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer on the first conductive semiconductor layer, and an active layer therebetween, and an electrode on at least one of the first conductive semiconductor layer or the second conductive semiconductor layer, wherein the electrode comprises: an adhesive layer on the light emitting structure;a barrier layer on the adhesive layer; anda bonding layer on the barrier layer, andwherein the barrier layer includes a plurality of grain boundaries, wherein interstitial elements are distributed in the barrier layer and the grain boundaries, wherein the grain boundaries include interstitial elements and eutectic materials between the interstitial elements.
地址 Seoul KR